Dry etching (ion plasma):
- RIE, DRIE
- FIB (Focus Ion Beam)
- Materials: Silicon (max 6 inches), Glass, Si3N4, LiNbO3,… (max 4 inches)
Wet etching:
- KOH, BHF
- Vapor HF Etching
Photolithography
UV & electronic lithography Photolithography mask manufacturing
Femto Engineering | From science to society
15B avenue des Montboucons, 25030 Besançon Cedex – France
- 03 63 08 24 14
- contact@femto-engineering.fr
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