Etching

Dry etching (ion plasma):

  • RIE, DRIE
  • FIB (Focus Ion Beam)
  • Materials: Silicon (max 6 inches), Glass, Si3N4, LiNbO3,… (max 4 inches)

Wet etching:

  • KOH, BHF
  • Vapor HF Etching

Others:

Integration & Packaging

Precision cutting ƒƒLapping & polishing ƒƒWire bonding ƒƒWafer bonding ƒƒMicro-assembly (flip-chip)

Characterisation

Microscope (MEB, optic, FIB), mechanical profilometer Specific measures : material constraints, optical index, contact angle