activités

Un panel de compétences pour répondre aux besoins des entreprises

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Deposition

Deposition of thin and thick layers

Deposition of thin and thick layers

PVD, ICPE CVD for metallic deposits (Al, Au, Cr, Ti, Pt, Ni, Cu, …) and oxides (SiO2, TiO2, ZnO, ZrO2 …)
Electrodeposition of thick layers, electroforming (Ni, Cu, Au)

UV & electronic lithography Photolithography mask manufacturing

Dry etching (ion plasma): RIE, DRIE FIB (Focus Ion Beam) Materials: Silicon (max 6 inches), Glass, Si3N4, LiNbO3,… (max 4

Precision cutting Lapping & polishing Wire bonding Wafer bonding Micro-assembly (flip-chip)

Microscope (MEB, optic, FIB), mechanical profilometer Specific measures : material constraints, optical index, contact angle