Nos activités : Microfabrication

Photolithography

UV & electronic lithography
Photolithography mask manufacturing

UV & electronic lithography

Coating by spin-coating & spray-coating. Single & Double Sided UV Aligner
Resin: positive & negative, Epoxy (SU-8)

Photolithography mask manufacturing

Resolution 800nm
Mask size: 4, 5, 6 and 7 ” & Direct writing on wafer 3 ” and 4 ”

contact : florent.bassignot@femto-engineering.fr

Others:

Deposition

Deposition of thin and thick layers

Etching

Dry etching (ion plasma): RIE, DRIE FIB (Focus Ion Beam) Materials: Silicon (max 6 inches), Glass, Si3N4, LiNbO3,… (max 4

Integration & Packaging

Precision cutting Lapping & polishing Wire bonding Wafer bonding Micro-assembly (flip-chip)

Characterisation

Microscope (MEB, optic, FIB), mechanical profilometer Specific measures : material constraints, optical index, contact angle