activités

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  • Nos activités : Microfabrication

Integration & Packaging

  • Precision cutting
  • ƒƒLapping & polishing
  • ƒƒWire bonding
  • ƒƒWafer bonding
  • ƒƒMicro-assembly (flip-chip)

Packaging

  • Wafer bonding: Anodic & Thermocompression (examples of our achievements: hybrid wafers)
  • Collage de puces : Wire bonding, Ball bonding

 

Packaging of optical components

  • Pigtailing single-mode fibers, PMF
  • Temperature control by Peltier modules
  • Custom PPLN and PPLT components
  • Polarized grids with periods from 5 to 100 µm
  • PPLN optical components for non-linear optics / frequency converters

 

contact : florent.bassignot@femto-engineering.fr

 

Others:

Etching

Dry etching (ion plasma): RIE, DRIE FIB (Focus Ion Beam) Materials: Silicon (max 6 inches), Glass, Si3N4, LiNbO3,… (max 4

Characterisation

Microscope (MEB, optic, FIB), mechanical profilometer Specific measures : material constraints, optical index, contact angle