FEMTO Engineering participe à Techninnov, the innovation business meetings, on February 27, Paris la Défense.
Find us on stand G11.
We will present our latest innovations in cleanroom microfabrication:
- Deep dry etching of dielectric materials,
- Multi-wafer bonding at room temperature,
- LIGA multi-level: SU-8 mold and Nickel parts,
As well as our new technique forcutting thick glasses using a femtosecond laser (several mm thick).
Contact : email@example.com