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Wafer Hybrid

FEMTO Engineering has developed a technology to obtain custom thin monocrystalline layers transferred onto wafers with diameters up to 4 inches.

BENEFITS

  • Material properties are preserved
  • Possibility of modulating the stacks according to:
    – materials: crystals, metals or polymers,
    – thickness: from a few microns to several hundred microns,
    – interfaces: metallic or insulating.

 

Our custom hybrid substrates:

Thin monocrystalline films on electrode or insulator

 

 

 

 

Support materials and custom thin layers among piezoelectric materials (quartz, PZT, LiNbO3),
optics (Glass, KBT, BSO …), semiconductors (Silicon) and other materials on request.

  • Wafer size: from sample to 4 inch diameter plates
  • Useful surface > 98%
  • Bonding strength > 25MPa
  • Layer thickness: from 1µm to a few hundred microns
  • Number of layers in the stack: 1 to 10

 

APPLICATIONS

  • Radio-Frequency: Resonators, sensors, filters…
  • Photonics: laser, electro-optical sensors…
  • MEMS: actuator, sensor

 

Others:

SPR chips

– Manufacturing of chips with plasmonic properties (SPR)
– Specific coatings (SiO2, TiO2, etc)
– Biofonctionnalization

Read more »

High resolution molds

– Polymer mold
– Metal mold
– Silicon mold

Read more »

Optical frequency converter

– PPLN manufacturing
– SHG components

Read more »

Femto Engineering | From science to society
15B avenue des Montboucons, 25030 Besançon Cedex – France

  • 03 63 08 24 14
  • contact@femto-engineering.fr

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