FEMTO Engineering is an R&D center of the foundation FC Innov

From science to society

Packaging

  • Wafer bonding: Anodic & Thermocompression (examples of our achievements: hybrid wafers)
  • Bonding of chips: Wire bonding, Ball bonding

Packaging of optical components

  • Pigtailing single-mode fibers, PMF
  • Temperature control by Peltier modules
  • PPLN and PPLT components custom-made
  • Polarized networks with periods from 5 to 100 μm
  • PPLN optical components for non-linear optics / frequency converters
Contact the department Microfabrication in cleanroom