Our work

Engraving

Microfabrication in cleanroom

Dry etching (ion plasma):

- RIE, DRIE

- FIB (Focus Ion Beam)

- Materials: silicon (6 inches max), glass, Si3N4, LiNbO3,... (4 inches max)

Wet engraving:

- KOH, BHF

- HF vapors

Besides silicon engraving, we have developed different methods of deep engraving of dielectric materials in clean room:

Engraved materials	Depth	Flanks verticality	Rugosité en fond de gravure
Glass	Up to 200 µm	70° at 100 µm	Ra < 500nm
Quartz	Up to 200 µm	85° at 100 µm	Ra < 10nm
Lithium niobate	Up to 10 µm	75° at 10 µm	Ra < 10nm

Benefits :

– Collective engraving of micrometric resolution patterns with depths up to a hundred microns
– New features for your devices
– Performance improvement of your devices

Different applications are covered:

– Structuring of microfluidic channels in biocompatible materials (Glass...)
– Production of optical waveguides in electro-optical materials (Lithium Niobate...)
– Etching of piezoelectric materials for radio frequency devices (Quartz…)

contact: jassem.safioui@femto-engineering.fr

We received financial support from the Bourgogne Franche-Comté region for the development of these processes.

Bourgogne-Franche-Comté region