{"id":3222,"date":"2020-04-22T17:06:09","date_gmt":"2020-04-22T15:06:09","guid":{"rendered":"http:\/\/www.femto-engineering.fr\/meet-us-at-techinnov-2020\/"},"modified":"2020-07-16T10:06:53","modified_gmt":"2020-07-16T08:06:53","slug":"meet-us-at-techinnov-2020","status":"publish","type":"post","link":"https:\/\/www.femto-engineering.fr\/en\/meet-us-at-techinnov-2020\/","title":{"rendered":"MEET US AT TECHINNOV 2020"},"content":{"rendered":"\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<p><img decoding=\"async\" width=\"300\" height=\"90\" src=\"https:\/\/www.femto-engineering.fr\/wp-content\/uploads\/2020\/04\/logo_techinnov-300x90.jpeg\" alt=\"\"\/><\/p>\n\n\n\n<p>FEMTO Engineering participe \u00e0 <strong>Techninnov, the innovation business meetings, on February 27, Paris la D\u00e9fense.<\/strong><\/p>\n<\/div><\/div>\n\n<p>Find us on <strong>stand G11<\/strong>.<\/p>\n\n<p>We will present our latest innovations in <strong><a href=\"https:\/\/www.femto-engineering.fr\/en\/microfabrication\/\">cleanroom microfabrication<\/a><\/strong>:<\/p>\n\n<ul class=\"wp-block-list\"><li>Deep dry etching of dielectric materials,<\/li><li>Multi-wafer bonding at room temperature,<\/li><li>LIGA multi-level: SU-8 mold and Nickel parts,<\/li><\/ul>\n\n<p>As well as our new technique for<strong>cutting thick glasses<\/strong> using a femtosecond laser (several mm thick).<\/p>\n\n<p>Contact : <a href=\"mailto:contact@femto-engineering.fr\">contact@femto-engineering.fr<\/a><\/p>\n\n<div class=\"wp-block-image\"><figure class=\"alignleft\"><img decoding=\"async\" src=\"https:\/\/www.femto-engineering.fr\/wp-content\/uploads\/2020\/04\/TECHINNOV-2020-stand-252x336-1.jpg\" alt=\"\"\/><\/figure><\/div>\n","protected":false},"excerpt":{"rendered":"<p>FEMTO Engineering participe \u00e0 Techninnov, the innovation business meetings, on February 27, Paris la D\u00e9fense. Find us on stand G11. We will present our latest innovations in cleanroom microfabrication: Deep dry etching of dielectric materials, Multi-wafer bonding at room temperature, LIGA multi-level: SU-8 mold and Nickel parts, As well as our new technique forcutting thick [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2351,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_seopress_robots_primary_cat":"","_seopress_titles_title":"","_seopress_titles_desc":"","_seopress_robots_index":"","footnotes":""},"categories":[73,77,74,76],"tags":[],"class_list":["post-3222","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-laser-en","category-microfabrication-en","category-news","category-robotics"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/posts\/3222","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/comments?post=3222"}],"version-history":[{"count":0,"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/posts\/3222\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/media\/2351"}],"wp:attachment":[{"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/media?parent=3222"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/categories?post=3222"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/tags?post=3222"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}