{"id":2894,"date":"2020-03-27T17:15:05","date_gmt":"2020-03-27T16:15:05","guid":{"rendered":"http:\/\/www.femto-engineering.fr\/equipement\/wafer-hybrid\/"},"modified":"2020-07-02T11:36:51","modified_gmt":"2020-07-02T09:36:51","slug":"wafer-hybrid","status":"publish","type":"equipement","link":"https:\/\/www.femto-engineering.fr\/en\/equipement\/wafer-hybrid\/","title":{"rendered":"Wafer Hybrid"},"content":{"rendered":"\n<p>FEMTO Engineering has developed a technology to obtain custom <strong>thin monocrystalline layers<\/strong> transferred onto wafers with diameters up to 4 inches.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>&#8211; Multi-material metallic bonding<br \/>\n&#8211; Multi-material thinning<br \/>\n&#8211; Multi-material thin layers<\/p>\n","protected":false},"featured_media":1951,"parent":0,"template":"","categories":[77],"tags":[],"class_list":["post-2894","equipement","type-equipement","status-publish","has-post-thumbnail","hentry","category-microfabrication-en"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/equipement\/2894","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/equipement"}],"about":[{"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/types\/equipement"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/media\/1951"}],"wp:attachment":[{"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/media?parent=2894"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/categories?post=2894"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.femto-engineering.fr\/en\/wp-json\/wp\/v2\/tags?post=2894"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}